ARM, IBM (NYSE: IBM), Samsung Electronics, Co., Ltd., GLOBALFOUNDRIES and Synopsys, Inc (NASDAQ: SNPS) today announced the delivery of the industry’s first complete vertically optimized 32/28 nanometer (nm) design platform. Demonstrating the strength of the collaboration established and announced at DAC a year ago, the companies are collectively providing a technology enablement solution for the design and manufacturing of advanced mobile and embedded devices.
The solution consists of optimized high performance, low-power processor and physical IP from ARM; tool enablement, connectivity IP and integrated design flow from Synopsys; and 32/28nm low-power process technology from the Common Platform alliance of IBM, Samsung and GLOBALFOUNDRIES. The Common Platform 32/28nm process uses an innovative high-k metal gate approach to address the limitations of polysilicon technology. It leverages the research and development efforts of the IBM joint technology development alliance to offer a high-performance, low-power manufacturing platform.
The 32nm technology is scalable to 28nm for area optimization. Customers can seamlessly transition to 28nm technology without the need for a major redesign and with lower risk, reduced cost and faster time-to-market.
This complete solution demonstrates the important role industry collaboration has in addressing the increasing complexity of SoC design as technology migrates to smaller geometries.
ARM, IBM, Samsung, GLOBALFOUNDRIES and Synopsys Announce Delivery of 32/28nm HKMG Vertically Optimized Design Platform
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