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SemIsrael Expo 2019
חדשות סמיקונדקטורס
Recent Blogs Posts
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The Roadmap to the Digital Thread Across The Product Lifecycle
Written by Siemens Blog27 July 2021 -
Teaming Up with Arm to Enhance AI, Cloud, and 5G Infrastructure Chiplets
Written by Synopsys Blog28 June 2021 -
Ensuring that Hyperscale Data Centers Can Live Up to Their Promise
Written by Synopsys Blog28 June 2021
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How an AI Strategy for Chip Design Enhances Productivity
Written by Synopsys Blog28 June 2021
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Faster SPICE Engines and a More Unified Simulation Workflow for Hyper-Convergent ICs
Written by Tom Hsieh13 May 2021 -
Hyper-Convergent Chip Designs Need a New Circuit Simulation Methodology
Written by Synopsys Blog13 May 2021
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How to Address the Verification Demands of Complex SoCs
Written by Johannes Stahl05 May 2021
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SemIsrael Expo 2021 - Join Us!
Gold Partners
Partners
Partners PRs
- SmartDV Leads Industry with Greatest Number of Design and Verification MIPI Protocol Standards Solutions for Mobile Applications
- Synopsys Advances Application Security Testing for Developers with Rapid Scan
- Siemens acquires FORAN software to expand capabilities in marine design and engineering
- Samsung Foundry and Synopsys Collaborate to Accelerate Time to ISO 26262 Compliance for Automotive SoCs
- Synopsys Strategic Partnership with Samsung Foundry Accelerates Access to Transformative 3nm GAA Technology
- Synopsys PrimeShield Selected by Samsung Electronics to Maximize Energy Efficiency and Performance for Next-Generation Process Node Designs
- AMIQ EDA Updates UVM Rule Checks for Latest Release of the Universal Verification Methodology Standard
- Synopsys to Acquire Semiconductor and Flat Panel Display Solutions from BISTel
דיווחים מהשטח
Israeli PRs
- Weebit completes design and tape-out of embedded ReRAM module
- Vecow Partners with AI Chipmaker Hailo to Launch Next-generation Edge AI Solution
- Camtek Receives an Order of $10 million for Multiple Systems from a Leading CMOS Image Sensor Manufacturer
- Valens Collaborates with Leading Sensor Vendor to Evaluate A-PHY Integration in Next-Generation Products
- Teramount Appoints Ilan Haber as Vice President of Product
- CEVA Expands Its Market-Leading Wireless Connectivity Portfolio with New Ultra-Wideband Platform IP
- Camtek Receives ~$60 Million In Orders Since Beginning Of April
- AI Chipmaker Hailo Partners with Lanner Electronics to Launch Next-generation AI Inference Solutions at the Edge
VC Action
New Jobs
Upcoming Events
| Tue, Nov 9th, 2021 SemIsrael Expo 2021 |
Upcoming Webinars
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