Corporate HeadquartersSuite 409, Building 1, No.88 ChenHui Road, Kingdee Software Park, Zhangjiang Hi-Tech Park Shanghai, 201203, China Phone: +86 (21) 50277866 Fax: +86 (21) 50271667 Corporate email
Israeli Officemicon Hayozma 3 st. Kfar Saba 44422 Tal Oren Phone: + 972-9-7666170 Fax: + 972-9-7666171 Israeli email
SoC and ASIC Design Company aimed at assembling the optimum IP, foundry, test and packaging technologies to create custom silicon solutions for its customers.
With a proven track record of first time silicon success and the experience of hundreds of tapeouts, Brite ensures minimum risk in physical design, test
engineering, packaging and assembly, wafer fabrication, and production support to be our customers’ ideal all inclusive ASIC partners.
- Brite Semiconductor and Power Line Communication Leader, Semitech Semiconductor, Collaborate on Industrial M2M SoC
- Brite Semiconductor Releases "YOU" Brand IP Portfolio and Silicon Platform Solution
- Brite Semiconductor Appoints Dr. C. Patrick Yue, Associate Provost at Hong Kong University of Science and Technology, as New Board Member
- NCAP China and Brite Semiconductor R&D Partnership for Complex System Packaging Solutions
- Brite Semiconductor Secures Series C Round of Finance from Norwest Venture Partners, Gobi Partners and China-based Foundry SMIC
- Brite Semiconductor Improves Quality of Results and Reduces Time to Market for Four SoC Designs with Cadence Digital Implementation and Signoff Tools
- Brite promotes SMIC’s IC ecosystem in DAC 2014
- Excellicon announces acquisition of its products by Brite Semiconductor to shorten timing closure process for faster product delivery
- CEVA, SMIC and Brite Semiconductor Partner to Provide Hard Macro Versions of CEVA DSP Cores and Platforms
- Brite Semiconductor Celebrates Fifth Anniversary